Infineon Introduces Wireless Receivers For Automotive and Consumer Applications Offering Highest Sensitivity, Low Power Consumption and Flexible Multi-Protocol Support

Neubiberg, Germany - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced an enhanced family of three wireless control receivers offering highest available sensitivity and low power consumption. The TDA5240, TDA5235 and TDA5225 devices provide multi-band support (315MHz, 434MHz, 868MHz and 915MHz) for worldwide coverage and are well-suited for use in various automotive applications, including Remote Keyless Entry (RKE) systems, Tire Pressure Monitoring Systems (TPMS), remote start, control, status and alarm functions. In addition, industrial and consumer systems such as short range radio data transmission, garage door openers, cordless alarm systems, remote metering and low-power telemetry will benefit from the high-integrated wireless control devices. The receivers also are capable of taking over some of the tasks that are typically performed by the system's microcontroller.

The TDA5240, TDA5235 and TDA5325 are successors to the TDA5230/31 receiver family. Two of the devices include the powerful digital data processing introduced with the TDA5230/31, with overall performance and feature set enhancements. Functionalities like IF filter (optional usage of external filter is possible) and level shifters are now integrated. Only a few external components are needed which leads to reduced BOM. An innovative integrated Low Noise Amplifier (LNA) concept provides the system developers with enhanced design alternatives. Depending on the application needs this LNA can extend the system range or eliminate the need for an external LNA to reduce system complexity and costs.

'Introduction of this new series of wireless control receivers underlines Infineon's market leadership in the RKE receiver segment,' said Matthias Halsband, Director Wireless Sense and Control within the Automotive division at Infineon Technologies. 'The new devices combine highest sensitivity and low power consumption with multi-protocol handling to increase performance and reduce system cost.'

High sensitivity of the new family (typically -119dBm for FSK and typically -116dBm for ASK) is due to a reduced noise figure and noise bandwidth using improved digital signal processing. Compared to Infineon's current receiver products, which offer an average data rate of 40kchip/s, the TDA5240/35/25 devices provide a data rate with several embedded encodings and modulation schemes specified at up to 112kchip/s (FSK).

System designers can use the multi-band, multi-channel receivers for systems operating at frequency bands 315/434/868/915MHz, with one crystal for all supported frequency bands. A high-resolution sigma-delta fractional-N PLL synthesizer provides a fine multi-channel resolution of 10.5Hz.

Multi-protocol handling enables flexible designs based on one platform. The receivers are able to handle data from both RKE and TPMS transmitters, even when they have different modulation, bit rate, and data format. Therefore only one device can be used for multiple applications (RKE, TPMS, remote start, etc.) where today there is the need for two.

The wireless control receivers are based on a CMOS process providing low power consumption. The supply current is only 0.8μA in power down and 12mA in run mode. An ultrafast fallback to sleep function reduces the receiver's active time, when no data is available for further reduction of the average power consumption. Up to four parallel parameter sets for autonomous scanning and reception from different sources reduce significantly the host processor and system standby power consumption.

The TDA5240 and TDA5235 support an autonomous receive mode where desired payload is automatically extracted and interrupts can trigger the host controller to read payload from the FIFO memory. The host controller remains asleep when unwanted RF-signals are received. This reduces noise from the host controller, which further improves sensitivity and reduces power consumption of the system. Support for additional encodings (bi-phase, NRZ) and market-leading coverage of automotive RKE/PASE/TPMS protocols results in high flexibility while minimizing software development effort. The TDA5225 comes without digital baseband processing to support designs based on standard concepts with data processed in the microcontroller.

Availability and Pricing

The product family members differentiate mainly in the multi-channel and digital baseband functionality. The new pin-compatible TDA5240/35/25 wireless control receivers in TSSOP-28 packages are available in volume production. The automotive qualified devices operate at a supply voltage of 3.3V or 5.0V and at the temperature range of -40 °C to 105 °C. Single unit price for 50k ordering quantities starts at Euro 0.80 (US $1.10) for the TDA5225. In addition, Infineon provides starter kits and tools to support the design-in of the new devices.

Further information on the TDA5240/35/25 wireless control receivers is available at www.infineon.com/wirelesscontrol and at www.infineon.com/TDA5240, www.infineon.com/TDA5235 and at www.infineon.com/TDA5225
About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

Further information is available at www.infineon.com.
Information Number

INFATV201007.059

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Fujitsu Selects Cypress’s Flexible TrueTouch™ Touchscreen Solution to Enable Separable Display for New docomo PRIME series F-04B Mobile Phone

Unique Handset Leverages Multitouch Touchscreen Solution For Ultra-Thin Interface with Independent Operation

SAN JOSE, Calif., - Cypress Semiconductor Corp. (Nasdaq: CY) today announced that Fujitsu Limited has selected Cypress's TrueTouch™ solution to implement the touchscreen in the world's first separable handset from NTT DOCOMO, the docomo PRIME series F-04B mobile phone. The new phone leverages Cypress's CY8CTMG200 controller to power the robust multitouch interface with a slim 9.8-mm form-factor that can operate separately from the keyboard. By detaching the phone's keyboard from the display, users can easily send e-mails, watch TV broadcasts or search address books using the touchscreen interface while talking on the baseband.

The flexible TrueTouch solution offers proven performance, durability and programmability for other Fujitsu phones, including the docomo PRIME series F-01A phone and the water-resistant docomo PRIME series F-01B phone.

'Our multiple design wins with Fujitsu and other top handset manufacturers around the world are a testament to the flexibility and proven performance of our TrueTouch solution,' said Norm Taffe, executive vice president of Cypress's Consumer and Computation Division. 'We continue to drive touch innovation with new features such as 1-mm stylus support, robust water-proofing and hover detection that empower our customers to deliver differentiated features and enhance the user experience.'

'The TrueTouch solution has provided the flexibility to meet Fujitsu's innovative feature requirements for the docomo PRIME series F-01A, F-01B and F-04B phones,' said Hitoshi Yoshizawa, Japan country manager for Cypress. 'Japanese handset makers are developing the world's most advanced phones, and it is fitting they are choosing TrueTouch as the industry's most advanced touchscreen solution.'

The docomo PRIME series F-04B phone integrates a 12.2-megapixel high-quality camera along with its 3.4-inch VGA display with user-friendly touch control. The display can be attached to a projector unit, enabling users to view phone content on a screen as large as 66 inches.

Cypress's TrueTouch family includes single-touch, multitouch and multitouch all-point offerings. Cypress was the first company to introduce multitouch all-point functionality, which can track an unlimited number of touches. This capability enables designers to create new usage models for products such as mobile handsets, portable media players (PMPs), GPS systems and other products, and has been in mass production since 2008. TrueTouch is the industry's most flexible touchscreen solution, as the unique PSoC architecture allows designers to implement differentiated features and make last-minute design iterations without board changes.

A video demonstration of Cypress's recently announced hover feature is available at www.cypress.com/go/hovervideo and a video on stylus support is available at www.cypress.com/go/stylusvideo.

The next-generation high performance TMA300 multi-touch all-point family provides best-in-class scan times for true multifinger touch and superior signal-to-noise ratio for the most demanding touchscreen applications. Additional information about the TrueTouch solution is available at www.cypress.com/go/TrueTouch.

The flexible TrueTouch solution allows customers to rapidly develop leading-edge solutions without having to buy turnkey modules. They have a choice of using touch sensors (glass or film) and LCDs from preferred partners, and can develop innovative mechanical designs ranging from flat to curved surfaces of varying thickness. In addition, TrueTouch devices offer Cypress's legendary noise immunity with patented capacitive sensing technology that enables flawless operation in noisy RF and LCD environments.

About Cypress
Cypress delivers high-performance, mixed-signal, programmable solutions that provide customers with rapid time-to-market and exceptional system value. Cypress offerings include the flagship PSoC® programmable system-on-chip families and derivatives such as PowerPSoC® solutions for high-voltage and LED lighting applications, CapSense® touch sensing and TrueTouch™ solutions for touchscreens. Cypress is the world leader in USB controllers, including the high-performance West Bridge® solution that enhances connectivity and performance in multimedia handsets. Cypress is also a leader in high-performance memories and programmable timing devices. Cypress serves numerous markets including consumer, mobile handsets, computation, data communications, automotive, industrial and military. Cypress trades on the Nasdaq Global Select Market under the ticker symbol CY. Visit Cypress online at www.cypress.com.

# # #

Cypress, the Cypress logo, PSoC, PowerPSoC, CapSense and West Bridge are registered trademarks and TrueTouch is a trademark of Cypress Semiconductor Corp. All other trademarks are property of their owners.

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IBM and MEMSIC Bring Ease of Use to Wireless Sensors

MEMSIC Adopts IBM Software to Enable Organizations to More Easily Harness Sensors and Find Patterns in Ubiquitous Data

ROSEMONT, Ill. - IBM (NYSE: IBM) today announced a contract with MEMSIC Inc. (Nasdaq: MEMS), a leading micro-electromechanical systems and sensor solution provider, to offer one of its most popular sensors with new IBM software that enables enterprises to build smarter products and systems. The announcement was made at the 2010 Sensors Expo & Conference.

Today, companies and governments are working to take advantage of wireless sensors and data analytics to: reduce cost and waste; improve efficiency and productivity; improve the ability to anticipate changes; and raise the quality of services, such as, healthcare, building maintenance and transportation. However, programming and connecting wireless sensors can be challenging, therefore limiting the ability of companies, governments and universities to take advantage of wireless sensor technology.

To change this, MEMSIC will bundle its IRIS wireless sensor motes with a new software platform called Mote Runner. Invented by IBM scientists in Zurich, Switzerland, this advanced hardware and software combination offers organizations a proven, low-cost sensor with open, portable, and developer-friendly software.

Motes -- also known as wireless sensor nodes -- gather sensory information, such as temperature, movement, or light and communicate that data across a network of wireless sensors.

Separately, IBM also announced the availability of the Mote Runner development kit as a free download on its emerging technologies website www.alphaworks.ibm.com.

"As a leading sensor manufacturer and wireless sensor networking infrastructure solution provider we are delighted to see ease of use brought to wireless sensor networks without compromising efficiency," said Steve Tsui, Vice President of Worldwide Sales, System Business at MEMSIC, Inc. "We share the same vision as IBM, of a world that is instrumented and connected with sensors, which is why we are pre-installing Mote Runner on our IRIS mote. This powerful combination will provide an efficient, scalable, easy to implement and cost effective solution."

About IRIS and Mote Runner

The MEMSIC IRIS is a 2.4 GHz wireless sensor mote used for enabling low-power wireless sensor networks, such as monitoring the temperature and electricity in a high rise office building or traffic patterns on a busy intersection.

Now pre-installed with Mote Runner, IRIS users can benefit from:

* The use of a programming language such as Java, in combination with a highly efficient virtual machine developed from the ground up for use in sensor networks, provides application portability while shielding developers from the complexities of the underlying hardware without sacrificing performance
* A simulation environment, a web-based management dashboard, and an integrated development environment based on Eclipse, provide a user-friendly platform for testing, debugging, and maintaining applications for MEMSIC IRIS motes running Mote Runner. This enables advanced simulation prior to deploying motes in the field, thus eliminating most programming errors before deployment
* The Mote Runner execution engine has been designed to be very efficient in terms of power consumption while delivering a high runtime performance; thus the combined Mote Runner/IRIS mote can be ideally used with energy harvesting techniques, to utilize for example, solar power as a source of energy
* Physical access to remotely deployed sensor motes to update them with new functionality is not an option for many mote deployment usage scenarios, such as installations across large agricultural areas, in a multi-story building, or in locations with unique climates such as a rain forests or glaciers. Mote Runner caters to this by including the ability to push or pull changes wirelessly with minimal interruption to the established network

"Mote Runner on MEMSIC IRIS motes is a wireless sensor network in a box," comments Thorsten Kramp, computer scientist, IBM Research. "The combination of MEMSIC's popular IRIS mote with Mote Runner makes developing for and operating a wireless sensor network easy and straightforward."

The contract was signed in June 2010. Sets comprising Mote Runner on MEMSIC motes can be ordered via all MEMSIC distribution and sales channels starting July 2010.

Available on IBM alphaWorks

To encourage exploration, the Mote Runner software development kit is available free of charge for non-commercial use to universities and students and available as a 90-day evaluation trial for corporate users on the IBM alphaWorks website at www.alphaworks.ibm.com/tech/moterunner. Free support is provided on the IBM alphaWorks website.

About IBM

For more information see http://www.ibm.com/smarterplanet

About MEMSIC Inc.

MEMSIC Inc. (Nasdaq: MEMS), headquartered in Andover, Massachusetts, is a leading provider of MEMS sensor components, sophisticated inertial systems and leading-edge wireless sensor networks for diverse real world applications ranging from automotive, consumer, industrial and aerospace. Our proprietary approach combines leading edge technologies with mixed signal processing circuitry to provide an industry-leading level of application support.

Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both.

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CSR and Intel to collaborate to take PC connectivity to the next level

Industry leaders join hands in bringing the latest bluetooth standard for wireless communication to the PC market

CAMBRIDGE, UK - CSR plc (LSE: CSR) announced it is collaborating with Intel Corporation to jointly develop a Bluetooth and Wi-Fi combination solution for the PC market, as part of CSR's ongoing selective partnership strategy. This will support the latest Bluetooth standards to enable new usages and improve the performance of the next generation of laptops, netbooks and other mobile devices. The Bluetooth and Wi-Fi combination solution is being designed to enable users to synchronise content such as music, photos and contact information with their PCs in a fraction of the time it takes for the same operation today. The resulting products are expected to benefit the computer industry through the combination of CSR's industry-leading Bluetooth technology, and market-leading Wi-Fi technology from Intel.

"Intel is the leader in overall PC platforms, and we look forward to working with them on the development of these new high-speed Wi-Fi and Bluetooth products," said Anthony Murray, Senior Vice President of the Audio and Consumer Business Unit at CSR. "We believe this product collaboration can bring significant benefits of the latest Bluetooth technology to mainstream consumers using PC platforms worldwide."

The product collaboration is consistent with CSR's strategy of selective partnerships to further extend the benefits of its connectivity and location technologies to mainstream consumers and is intended to strengthen the company's position in the PC connectivity market.

"As handheld, mobile and peripheral devices with Bluetooth are increasingly inter-connected to notebooks, our customers want the familiar interoperable connectivity experience," said Aicha Evans, General Manager of Intel's Mobile Wireless Group. "We are working closely with CSR to integrate its best-in-class Bluetooth technology into our award winning wireless roadmap and look forward to bringing the benefits of this collaboration to our customers and consumers."

CSR was the first company to qualify a Bluetooth v3.0 + HS product, and in 2009 CSR achieved more Bluetooth design wins than all of its competitors combined.

About CSR
CSR is a leading provider of multifunction connectivity, location and audio platforms. CSR's technology portfolio includes Bluetooth, GPS, GNSS, FM, Wi-Fi (IEEE802.11), UWB, NFC and other technologies to enable platforms that incorporate fully integrated radio, signal processing and microcontroller elements along with appropriate algorithms and software to enrich user experience.

CSR's Connectivity Centre is designed to enhance the user experience in mainstream mobile devices by intelligent integration of multiple wireless connectivity and location-awareness technologies. CSR's Location Platforms are complemented by wireless connectivity and multimedia capabilities for high-volume mobile consumer devices and commercial applications.

CSR's technology has been adopted by market leaders into a wide range of mobile consumer devices such as mobile phones, automobile navigation and telematics systems, portable navigation devices (PNDs), wireless headsets, mobile computers, mobile internet devices, GPS recreational devices, digital cameras, mobile gaming, plus a wide range of personal and commercial tracking applications. CSR acquired SiRF on June 26, 2009, and SiRF Technology Holdings, Inc. became a member of the CSR group of companies.

More information can be found at www.csr.com.

Cautionary Note Regarding Forward-Looking Statements
This press release contains certain statements (including statements concerning plans and objectives of management for future operations or performance, or assumptions related thereto) that are 'forward-looking statements' within the meaning of the United States Private Securities Litigation Reform Act of 1995 in relation to product collaboration with Intel Corporation concerning a Bluetooth and Wi-Fi combination solution for the PC market, and other future events and their potential effects on CSR.

These forward-looking statements can be identified by words such as 'can,' 'will,' 'are expected to,' 'being designed to,' 'enabling' and other similar expressions regarding the product collaboration between CSR and Intel and the performance characteristics of the Bluetooth and Wi-Fi combination solution for the PC market. There can be no assurance of a future commercially released product developed in connection with the collaboration with Intel, market acceptance of such product, or the timing of any such release and the collaboration described in this release should not be considered firm commitments or assurances by CSR (nor Intel) or any guidance or forecast of future business or revenues, and should not be relied upon in making investment decisions. Such forward-looking statements contained in this release represent the current expectations and beliefs of management of CSR, and are based upon numerous assumptions regarding CSR's business strategies and the environment in which CSR will operate and therefore involve a number of known and unknown risks, contingencies, uncertainties and other factors, many of which are beyond the control of CSR. Each forward-looking statement speaks only as of the date hereof. CSR does not undertake to release publicly any updates or revisions to any forward-looking statements contained herein, other than as required by law.

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Qualcomm Ships First Dual-CPU Snapdragon Chipset

Third-generation Snapdragon Solutions Feature Two Application Processor Cores Running up to 1.2 GHz to Enable Advanced Smartphones

TAIPEI, Taiwan - Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of wireless technologies, products and services, today announced the Company has sampled its first dual-CPU Snapdragon™ chipsets. The Mobile Station Modem™ (MSM™) MSM8260™ and MSM8660™ solutions integrate two of the Company's enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company's expanded Snapdragon platform, which has been powering smartphones, tablets and smartbook devices in markets around the world.

'Qualcomm's first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume,' said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. 'We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets.'

The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000® 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.

Qualcomm's Snapdragon family of chipset solutions includes:
• First-generation products: QSD8x50™ with 1GHz enhanced core
• Second-generation products: MSM8x55™ and QSD8x50A™ with 1GHz enhanced core, including multimedia optimizations and 1.3GHz enhanced core, respectively
• Third-generation products: MSM8260, MSM8660 and QSD8672 with dual-CPU architecture featuring enhanced cores running at up to 1.2GHz and 1.5GHz, respectively

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2010 FORTUNE 500 company. For more information, please visit Qualcomm around the Web:

www.qualcomm.com
Blog: www.qualcomm.com/blog
Twitter: www.twitter.com/qualcomm
Facebook: www.facebook.com/qualcomm .

Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of ASIC components on a timely and profitable basis, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 27, 2009, and most recent Form 10-Q.

###

Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Station Modem , MSM, MSM8260, MSM8660, MSM8x55, QSD8x50, QSD8x50A, and Snapdragon are trademarks of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

In the territory of the Federal Republic of Germany, the use of the term 'Smartbook' in connection with portable computers is reserved exclusively to Smartbook AG, Germany.

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SiBEAM President and CEO, John LeMoncheck, Named to the Global Semiconductor Association’s (GSA) Emerging Company CEO Council

Sunnyvale, California– May 31, 2010 – SiBEAM CEO and President, John LeMoncheck, was recently appointed as a member of the Global Semiconductor Association's (GSA) Emerging Company CEO Council. This GSA Council is comprised of CEOs from companies with proven technical and market leadership and promising new technologies, to advise GSA's board of directors on emerging company needs and to support GSA's focus on entrepreneurship.
GSA has made a significant impact on the industry since their inception in 1994, playing a vital role with the emergence and worldwide adoption of the fabless business model. GSA's mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation.
'I'm honored to serve on the GSA's Emerging Company CEO Council and believe that participation in this council will serve a mutual industry goal of advancing the fabless semiconductor business model,' said John LeMoncheck.
Emerging Company CEO Council Members include companies throughout the supply chain that represents 25 countries across the globe.
'We are delighted that John LeMoncheck, CEO of SiBEAM and GSA member since 2007, has recently joined the GSA Emerging Company CEO Council,' said Jodi Shelton, GSA president. 'We depend on our members to help us advance our goals, and SiBEAM brings a valuable combination of insight, innovation and industry-leading technology for a rapidly growing market segment. We look forward to SiBEAM's continued contributions in collaboration with our expanding member roster.'
SiBEAM, winner of the GSA's prestigious 'Startup to Watch' award and the first and only company to ship 60 GHz communication systems for consumer electronics, personal computing and mobile devices, is the established leader in 60 GHz communications systems. The company is currently shipping its second generation 60 GHz chipsets, based on the globally available WirelessHD standard. Their wireless technology is capable of achieving up to 4 Gbps data rates, which is ten times faster than today's consumer wireless technologies. Products from Best Buy's Rocketfish private label brand, LG Electronics, Panasonic, Sony and others have been shipping since early 2009.

About John LeMoncheck
John LeMoncheck is President and CEO of SiBEAM, Inc. LeMoncheck hails from Silicon Image where he was vice president of CE and PC/Display business and was responsible for all product, market and business strategy development and execution including leading the company's efforts to promote worldwide adoption of HDMI. Prior to Silicon Image, LeMoncheck was vice president of software and systems engineering for TeraLogic (purchased by Zoran), directing all platform and software implementations for TeraLogic's digital television solutions. Before TeraLogic, LeMoncheck was a member of the founding team at Arithmos, Inc (purchased by ST Microelectronics) where he was vice president of engineering and developed Arithmos' line of display processors targeted at the flat panel market. In the past, LeMoncheck also directed The LEGO Company's West Coast design center, which was focused on high-tech toys, including the successful MINDSTORMS product line. LeMoncheck earned his BSEE from U.C. San Diego and spent several years researching VLSI for imaging and pattern recognition applications during his graduate studies at Caltech.

About SiBEAM, Inc.
SiBEAM is a fabless semiconductor company and founding member of the WirelessHD™ Consortium. A pioneer in developing intelligent millimeter wave technologies for wireless communications, SiBEAM is the first to build 60GHz chipsets using standard CMOS technology. The first applications for the company's innovative technology are based on the WirelessHD™ specification for home multimedia content delivery and A/V connectivity. SiBEAM is a global leader in driving the architecture and semiconductor implementation for the distribution and presentation of high-definition content in the consumer electronics and personal computing markets. Solutions for wireless personal area networks (WPAN) and automotive will follow. The company was founded in 2004 and is headquartered in Sunnyvale, California, with offices in San Diego, Seoul and Tokyo. For more information please visit: www.sibeam.com.

About GSA
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org

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Infineon Further Boosts GPS System Sensitivity Introducing the World’s Smallest Fully Integrated Receive Front-End Module for GPS Applications with Low Current Consumption

Neubiberg, Germany - Fulfilling requirements of the growing mobile GPS market for higher sensitivity, higher immunity against interference of cellular signals and low power consumption, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the next generation of its world's smallest GPS Receive Front-End Module. The new BGM781N11 further boosts GPS sensitivity to enable, for example, E911 emergency call requirements for mobile phones, personal navigation devices and other handheld systems, and GPS applications in vehicles. Including all key components to amplify a GPS signal and filter out interference, the module measures just 2.5mm x 2.5mm x 0.7mm in size, which is more than 60 percent smaller than the closest competitive product offering a similar integration level.

The BGM781N11 GPS receive front-end module integrates one GPS Low Noise Amplifier (LNA) and two Surface Acoustic Wave (SAW) filters with high electrostatic discharge (ESD) ruggedness in a tiny leadless TSNP11-2 package. With the BGM781N11 only two external passive components are required in a GPS application, compared to competitor solutions typically using between six and ten passives. As more and more features are added to new generations of high-end mobile phones, PCB space becomes the main limiting factor, so front-end modules that are small size and need few additional components are highly desirable. In addition, the BGM781N11 has very low power consumption, just 5.94 mW, and supports a wide power supply range between 1.5V and 3.6V.

In order to minimize damage from ESD in portable electronic products, the BGM781N11 offers a very high ESD robustness. With 8kV ESD Contact Discharge integrated at the RF input pin, manufacturers of GPS-enabled devices can easily achieve system ESD requirements (typically 8 kV) without additional ESD protection devices. Fulfilling the very important mobile GPS market requirement of higher sensitivity, Infineon's GPS receive front-end module offers a high gain of 18.6dB which is more than 20 percent better than the 16.5dB of current competitor solutions.

'Market experts expect GPS to further penetrate all kinds of applications and devices and to be featured in at least one third of all mobile phones to be produced in 2011, becoming a standard feature for the next generations of mobile phones,' said Michael Mauer, Senior Marketing Director, RF and Protection Devices at Infineon Technologies. 'Infineon is committed to continue developing a strong portfolio of completely integrated, high-performance GPS receive front-end modules. With the GPS receive front-end module BGM781N11 Infineon underlines our leading position in the GPS market.'

Availability, Package and Pricing

The BGM781N11 GPS Receive Front-End Module is available in high-volume quantities. Infineon also provides evaluation kits. Pricing of the BGM781N11 starts at a 10,000-piece price of USD 1.00. It is shipped in a tiny leadless TSNP11-2 package of only 2.5mm x 2.5mm x 0.7mm in size.

Further technical information on the GPS Receive Front-End Module is available at www.infineon.com/BGM781N11
About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

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SiBEAM Experiences Industry-Shifting Momentum at CES 2010

WirelessHD® Chipsets Featured in Flagship Products from Leading CE Manufacturers; Lower Cost, Lower Power Chipsets and IP Licensing Program Drives Ecosystem Growth

Sunnyvale, California– January 13, 2010 – At the 2010, International Consumer Electronics Show (CES), SiBEAM, Inc., a leading innovator of millimeter wave (mmWave) solutions and developer of high-speed wireless communications platforms, delivered on its promise to lead the industry in the adoption and implementation of 60 GHz solutions in new market segments within the CE and PC industries.

At the show, SiBEAM highlighted formal entry into mass production of its second generation chipsets, the launch of its IP licensing program designed to address increased demand for embedded 60 GHz solutions, and demonstrations in flagship products from industry leaders such as VIZIO, Toshiba, Panasonic, Monster and others, signaling the expansion of the WirelessHD ecosystem. SiBEAM also announced a strategic partnership with Best Buy Co. Inc., the largest consumer electronics outlet in the United States.

SiBEAM's Second Generation WirelessHD Chipsets Enter into Mass Production
Last year at CES 2009, SiBEAM announced that its line of first generation WirelessHD chipsets had hit mass production levels to support expanded partner product development activity. Just one year later, SiBEAM announced its entry into mass production of its second generation chipsets that consist of lower cost, lower power transmitter and receiver chipsets, each including an RF IC and network processor. The SB9220 Network Processor and the SB9210 RF Transmitter may be designed into devices such as A/V receivers, home theater-in-a-box systems, Blu-ray players, set-top boxes and media center PCs. The SB9221 Network Processor and the SB9211 RF Receiver chipset may be used in digital televisions, monitors and front projectors. The significant reduction in both cost and power achieved in these second generation chipsets greatly assist CE and PC manufacturers by reducing overall system cost and optimizing video quality.

Demonstrations of SiBEAM's WirelessHD Chipsets Abound at CES 2010
A testament to the growing WirelessHD ecosystem, SiBEAM's WirelessHD chipsets, integrated into several devices were showcased in several public and private demonstrations at CES 2010.
o VIZIO: America's #1 LCD HDTV Company, announced that it has chosen to integrate WirelessHD technology and SiBEAM 60 GHz chipsets, based on the globally available WirelessHD standard, into a new line of LCD HDTVs, WirelessHD adapters and Blu-ray players. VIZIO is also in the process of joining WirelessHD as an Adopter with the intent of incorporating WirelessHD technology into a wide range of product offerings for the consumer. At CES 2010, VIZIO demonstrated WirelessHD technology integrated into their new line of XVT Pro LCD LED HDTVs in 47, 55 and 72' configurations embedded with SiBEAM chipsets. SiBEAM also showcased a WirelessHD-powered VIZIO LCD TV and Blu-ray player. One demonstration featured Full HD 3D display over WirelessHD technology from a VIZIO Blu-ray disc player to their 72' XVT Pro.
o Toshiba: The company introduced their powerful ZX900 Series CELL TV™ capable of converting any 2D content into 3D content, in real time. The CELL TV offers a robust set of advanced connectivity options including WirelessHD, which allows the CELL set-top box to connect to the display without running any wires to the wall.
o Panasonic: A winner of the prestigious CNET Best in Show award for their 3D VT25 TV Series, Panasonic demonstrated its wireless 1080p Full HD 3D transmission system in its 3D End-to-End Solution Zone. This represented an evolution of the current WirelessHD standard that can transmit uncompressed 1080p Full HD 3D signals standardized by the Blu-ray Disc Association. Panasonic plans to accelerate the process of standardization of uncompressed 1080p Full HD 3D for next generation WirelessHD using this technology.
o Monster Cable Products: Monster exhibited its Digital Express XStream ultimate high speed wireless HDMI adapters based on WirelessHD that offer wired equivalent connections with zero latency, ideal for the gaming community.
o Abocom, Gefen and Cables-to-Go also exhibited their WirelessHD Adapters.
o SiBEAM: SiBEAM's demonstrations featured a WirelessHD-powered VIZIO LCD TV and Blu-ray player, as well as chipset modules from Azurewave, Murata, and SEMCO. Also on display were WirelessHD Adapters from Abocom and Best Buy's Rocketfish private label brand as well as a Home Theater-in-a-box system from Eastech Electronics. In addition, SiBEAM demonstrated the power of a WirelessHD-enabled living room by demonstrating a complete wireless video area network that included a notebook PC, portable media player, media server, gaming console, A/V receiver, Blu-ray player and an HDTV. Viewers were able to control the devices with one simple IR remote that sent commands over the WirelessHD network, as well as seamlessly switch between devices and even download content using WiFi enabled devices that could run at full speed while not interfering with the WirelessHD video area network. SiBEAM also demonstrated its 3D over WirelessHD system using their second generation chipsets.

Newly Launched IP Licensing To Power Increased WirelessHD Growth
Building momentum to expand SiBEAM application areas with its second generation chipsets, SiBEAM launched an IP Licensing program to kick-start the development of embedded designs with WirelessHD technology. Through this program, SiBEAM will partner with industry leaders and provide incentives for the development of both fixed and portable WirelessHD A/V applications.

SiBEAM will provide program participants with access to its full SB9220 chipset IP core that includes the MAC, PHY and embedded beam steering algorithms, WirelessHD SB9220 technical training, the SB921x WirelessHD RF Transceiver interface, verification environment and IP documentation.

'We are excited about the launch of our IP Licensing program and at this show, have received great feedback and interest from industry members,' said John LeMoncheck, SiBEAM CEO. 'We've made significant ecosystem progress marked by various demonstrations of our chipsets this week and we anticipate additional source device designs such as Blu-ray players and gaming consoles beginning this spring.'

SiBEAM's Leadership in 60 GHz WirelessHD Development Gains Investment from Best Buy
At CES 2010, the WirelessHD consortium also announced its next generation specification that adds greater resolution, 3D, higher data rates and support for portable devices. This in addition to the launch of SiBEAM's Gen 2 chipsets that enable the development of smaller, more energy-efficient transmitter and receiver devices, make wireless simpler to implement in a wide range of products and applications.

Representing a show of confidence in the market and interest in the delivery of a variety of WirelessHD applications, Best Buy, who also manages the high-end Magnolia Audio Video stores, has invested in SiBEAM. This strategic partnership follows Best Buy's recent release of its Rocketfish WirelessHD Adapter powered by SiBEAM's 60GHz WirelessHD chipsets.

About SiBEAM, Inc.
Founded in 2004, SiBEAM is a fabless semiconductor company developing intelligent millimeter wave technologies and leveraging the latest manufacturing methods to meet the demand for high-bandwidth services. SiBEAM is the first to build 60 GHz chipsets using CMOS technology. The first of many applications for SiBEAM's innovative technology is based on WirelessHD®. As a founding member of the WirelessHD® Consortium, SiBEAM is a leader in driving the architecture and semiconductor implementation for the distribution and presentation of high-definition content in the consumer electronics and personal computing markets. For more information please visit: www.sibeam.com.

About WirelessHD, LLC
Formed in 2006, Broadcom Corporation, Intel Corporation, LG Electronics Inc., Panasonic Corporation, NEC Corporation, Philips, SAMSUNG ELECTRONICS CO., LTD, SiBEAM Inc., Sony Corporation and Toshiba Corporation, joined together to define the next generation worldwide 60GHz multi-gigabit millimeter wave technology for mobile and stationary consumer and enterprise applications. WirelessHD is the first consumer electronics and technology industry-supported, digital wireless interface for instantaneous file transfers, wireless display and docking, and simplified and lossless HD media streaming. For more information on WirelessHD, please visit www.wirelesshd.org.

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Celeno Announces 2™ Generation CL1800 Beam Forming 802.11n Chipset – Quadruples Performance of 802.11n Systems

Fully integrated silicon solution powered by OptimizAIR™ expert system enhances 802.11n for whole-home HD video distribution

CES 2010, Las Vegas - Celeno Communications, a leading provider of semiconductors for multimedia Wi-Fi home networking applications, announced today the immediate availability of the CL1800, its second generation 802.11n chipset. The new CL1800 is powered by Celeno's field-proven OptimizAIR™ technology suite that optimizes 802.11n performance for whole-home HD video distribution applications. Manufacturers and Original Equipment Manufacturers (OEMs) can leverage the CL1800 to enable residential gateways, multimedia home routers, set top boxes, digital video recorders (DVR), networked TVs, wireless HDMI bridges and a variety of other Consumer Electronics (CE) devices with robust, wire-like, HD video distribution throughout the home.
High Performance

The robust chipset builds on the success of the CL1300, Celeno's first generation HD video Wi-Fi chipset and its field-proven Implicit Transmit Beam Forming technology. The CL1800 quadruples the video throughput/range combination of typical 802.11n systems, reaching over 120Mbps of video throughput at the edge of the home with zero packet errors. The chipset supports up to 8 concurrent HD video streams. Faithful to the CL1300 principles, the second generation CL1800 meets carrier grade performance requirements while maintaining client silicon agnostic operation.
Technical Details

The CL1800 is a highly integrated chipset combining an 802.11n MAC/PHY baseband, dual band radio and a powerful CPU. This architecture gives the manufacturer a powerful, yet cost effective and compact solution. The SoC includes a powerful MIPS processor and complementary software, enabling it to run as a completely self-contained unit. This frees the host CPU from any Wi-Fi MAC processing, hence simplifying integration of the CL1800 into devices such as gateways and DVRs.

Key features of the CL1800 include:

* 2.4GHz/5GHz Dual band
* Up to 3 spatial streams
* PHY rate of up to 450Mbps
* 20MHz/40MHz channel bandwidth
* Transmit digital beam forming
* PCI/PCIe/RGMII/MII/USB interfaces

The OptimizAIR™ features suite builds on top of standard 802.11n and combines several innovative technologies that work together intricately at all layers to boost performance and throughput, as needed to support whole-home HD video streaming. These include Transmit Beam Forming MIMO for increased range, TDM Scheduled MAC to support multiple clients with the appropriate QoS, channel aware rate selection for zero packet error rate, real time antenna diversity for robustness and interference resiliency based on adaptive interference detection, fast channel selection and dynamic 20/40MHz operation. The OptimizAIR™ expert system drives up performance by applying real time packet-by-packet channel estimation to each one of those elements, for fully channel-aware silicon.

The CL1800 was jointly developed with Ralink as part of the companies' strategic partnership.
Availability and Ordering Information

The CL1800 family of products includes two variants: the high-end CL1830 supports up to three transmit and three receive radios; the cost-effective CL1820 supports two transmit and three receive radios.

The CL1800 and selected reference designs are now available to customers. Celeno will be displaying these products at CES 2010 in Las Vegas (South Hall 4, Booth #36071MP).
About Celeno

Celeno is a leading provider of high performance Wi-Fi chips for HD multimedia and entertainment home networking applications. Powered by Celeno's system-on-chip (SoC) and its OptimizAIR™ technology, home gateways, multi-room DVRs and media servers can distribute multiple and simultaneous HD video streams to standard set-top boxes, PCs, television sets and other Wi-Fi enabled consumer devices. Founded in 2005, the company has offices and representatives in EMEA, the U.S. and Asia-Pacific and is backed by blue chip investors including Cisco Systems, Greylock Partners and Pitango Venture Capital. www.celeno.com

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DOCOMO Develops 8-Band Power Amplifier for Mobile Phones

TOKYO, JAPAN --- NTT DOCOMO, INC. announced today that it has developed a prototype multi-band power amplifier that accommodates eight frequency bands between 700 MHz and 2.5 GHz, paving the way for lightweight, all-in-one mobile phones capable of standalone wireless communications of different standards, including the forthcoming extra-fast LTE standard as well as existing W-CDMA and GSM.

Power amplifiers are used in mobile phones to increase signal power up to levels required for wireless communication.

As conventional multi-band phones must employ a separate single-band amplifier for each band, the sizes of these phones will inevitably increase to accommodate new frequency bands for LTE services being launched in markets worldwide, including Japan.

DOCOMO's new amplifier, which offers gain and output power equivalent to those of conventional single-band amplifiers, paves the way for multi-standard mobile phones that are generally no larger than existing models. It enables 8-band operation by employing matching circuits whose frequency characteristics are controlled by multiple semiconductor switches according to the required frequency band.

DOCOMO will present its new amplifier at the 2010 IEEE Radio and Wireless Symposium in New Orleans, Louisiana, United States, from 10:30 AM on January 11.

About NTT DOCOMO
NTT DOCOMO is the world's leading mobile operator and provider of advanced mobile services. The company serves over 55 million customers in Japan, including 48 million using i-mode™, the world's most popular mobile e-mail/Internet platform, and 51 million using FOMA™, the world's original 3G mobile service based on W-CDMA. As a leader in the development of cutting-edge mobile technologies, DOCOMO is continually expanding the role of mobile phones as versatile and highly personalized "lifestyle tools" for everyday life, including with a wide range of innovative services for mobile payments, GPS, mobile TV, multimedia content and much more. NTT DOCOMO is listed on the Tokyo (9437), London (NDCM) and New York (DCM) stock exchanges. For more information, visit www.nttdocomo.com.

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